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Wolfspeed
2026-09-28 01:01:50

Wolfspeed rolls out 200 mm silicon carbide substrate as LITEON adopts SiC for AI data center power

Wolfspeed (NYSE: WOLF) has introduced a new premium 200 mm N-type silicon carbide (SiC) substrate, adding to its wafer materials portfolio with a product aimed at improving manufacturing yield. According to the company’s release, the substrate uses upgraded material quality to cut defect density and improve wafer shape stability. X-ray topography analysis verified a micropipe density below 0.01 per square centimeter, or fewer than three micropipes per wafer, alongside very low screw dislocation density. The company said those characteristics can reduce starting material variation, lower defect rates, keep batch performance more consistent, and improve downstream process results. Wolfspeed added that this can help semiconductor manufacturers raise first-pass design success rates and reduce certification delays. Cengiz Balkas, Ph.D., executive vice president of Wolfspeed’s materials business, said the 200 mm product portfolio reflects the company’s expertise in silicon carbide materials. LITEON has also adopted Wolfspeed’s SiC solution in its 800 VDC side-car cabinet power system for AI computing data centers. The setup uses SiC MOSFETs to improve power conversion efficiency in high-power computing environments and lower cooling costs. Wolfspeed said it has been producing 200 mm wafers since 2022, while its supply chain footprint includes a 10-year, $2 billion agreement with Renesas and downstream adoption by GM, Mercedes-Benz, and ZF.

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Wolfspeed rolls out 200 mm silicon carbide substrate as LITEON adopts SiC for AI data center power
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